Precision oscillator having linbus capabilities

ABSTRACT

The integrated system on a chip with LINBUS network communication capabilities includes processing circuitry for performing predefined digital processing functionalities on the chip. A free running clock circuit generates a temperature compensated clock that does not require a synch signal from external to the chip. A LINBUS network communications interface digitally communicates with off-chip LINBUS devices. Communication between said on-chip LINBUS communications interface and the off-chip LINBUS devices is affected without clock recovery. The LINBUS network communication interface has a time base derived from the temperature compensated clock which is independent of any timing information in the input data received during a receive operation. The temperature compensated clock further provides an on-chip time reference for both the processing circuitry and the LINBUS network communications interface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This present application is related to U.S. patent application Ser. No. 09/885,459, filed Jun. 19, 2001 and entitled “FIELD PROGRAMMABLE MIXED-SIGNAL INTEGRATED CIRCUIT”, issued Jan. 30, 2007 as U.S. Pat. No. 7,171,542, which is incorporated herein by reference; U.S. patent application Ser. No. 10/244,728, filed Sep. 16, 2002 entitled “CLOCK RECOVERY METHOD FOR BURSTY COMMUNICATIONS,” issued Jul. 12, 2005 as U.S. Pat. No. 6,917,658, which is also incorporated herein by reference; U.S. patent application Ser. No. 10/244,344, filed Sep. 16, 2002, entitled “PRECISION OSCILLATOR FOR AN ASYNCHRONOUS TRANSMISSION SYSTEM,” which is incorporated herein by reference; and is a Continuation in Part of U.S. patent application Ser. No. 11/395,378, filed Mar. 31, 2006 entitled “PRECISION OSCILLATOR HAVING IMPROVED TEMPERATURE COEFFICIENT CONTROL,” which is incorporated herein by reference.

TECHNICAL FIELD OF THE INVENTION

The present invention relates to precision oscillators, and more particularly, to precision oscillators including linbus capabilities.

BACKGROUND OF THE INVENTION

Interface circuits are generally in the form of integrated circuit chips, which are disposed between a data providing circuit, such as, for example, a personal computer (PC) and a peripheral driver provide parallel-to-serial and serial-to-parallel data conversion. Interface circuits can be incorporated into the communication port of a more complex integrated circuit chip. Communication interface circuits generally include an oscillator and a crystal to synchronize data conversion with a fairly precise oscillator frequency, which facilitates asynchronous communications. The purpose for having a crystal controlled oscillator is to ensure that the frequency of a specific device is within a defined limit specified for the device operation. The use of an on-chip free-running oscillator, built entirely of integrated components, e.g. transistors, resistors, capacitors, inductors, etc., but no crystal, will typically not be acceptable due to temperature drift, manufacturing tolerances, supply voltage variation, etc. On the other hand, crystals are typically external devices, thus requiring a more complex external assembly.

SUMMARY OF THE INVENTION

The present invention, as disclosed and described herein, comprises in one embodiment thereof an integrated system on a chip having LINBUS network communications capabilities. This system includes processing circuitry for performing predefined digital processing functions on the chip. An on-chip free running clock circuit generates temperature compensated clock signals without the requirement of a synch signal from a source external to the chip. An on-chip LINBUS network communication interface digitally communicates with off-chip LINBUS devices. The communications between the on-chip LINBUS network communications interface and the off-chip LINBUS device is affected without clock recovery, and the LINBUS network communication interface has a time based derived from the temperature compensated clock which is independent of any timing information in the input data received from the off-chip LINBUS device. The temperature compensated clock provides on-chip time reference for both the processing circuitry and the LINBUS network communications interface.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following description taken in conjunction with the accompanying Drawings in which:

FIG. 1 illustrates an overall block diagram of a mixed-signal integrated circuit utilizing a UART in association with one of the communication ports;

FIG. 2 illustrates a more detailed diagram of the integrated circuit of FIG. 1;

FIG. 3 illustrates a block diagram of the UART;

FIG. 3A illustrates a block diagram of the baud rate generator;

FIG. 4 illustrates a block diagram of the precision oscillator;

FIG. 5 illustrates a more detailed diagram of the precision oscillator of FIG. 4;

FIG. 6 illustrates an output waveform diagram of a precision oscillator;

FIG. 7 illustrates a schematic diagram of the temperature compensated reference voltage;

FIG. 8 illustrates a schematic diagram of one-half of the output wave shaping circuit;

FIG. 9 illustrates a schematic diagram/layout for one of the resistors illustrating the mask programmable feature thereof;

FIG. 10 illustrates a schematic diagram of the programmable capacitor;

FIG. 11 illustrates a schematic diagram of the comparator;

FIG. 12 illustrates a logic diagram for the S/R latch in combination with the comparator;

FIG. 13 illustrates a schematic diagram of the delay block;

FIG. 14 illustrates a schematic diagram for an offset circuit for the comparator;

FIG. 15 illustrates a block diagram of one instantiation of the oscillator; and

FIGS. 16 and 17 illustrate tables for the oscillator controls;

FIG. 18 illustrates a schematic diagram of the precision oscillator including a programmable resistor array;

FIGS. 19 a and 19 b is a schematic diagram of a programmable resistor array implementing a funneling scheme to control leakage currents;

FIG. 20 is a flow diagram illustrating the process for controlling the programmable resistor area of FIGS. 19 a and 19 b;

FIGS. 21 a and 21 b illustrates a further embodiment of a programmable resistor array implemented utilizing low leakage switches;

FIG. 22 is a schematic diagram of an individual low leakage switch implemented within the programmable resistor array of FIG. 21; and

FIG. 23 is a schematic diagram illustrating an implementation of a programmable resistor array for the top resistor of the resistor voltage divider providing a voltage input to the precision oscillator.

FIGS. 24 a and 24 b is a schematic diagram of the SR latch of the precision oscillator;

FIG. 25 is a schematic diagram of the comparators used within the precision oscillator;

FIG. 26 is a flow diagram illustrating the operation of the source degeneration circuit of the comparator;

FIG. 27 illustrates the programmable offset voltage circuit provided by the comparator;

FIG. 28 illustrates utilizing the curvature of the temperature variation provided by transistors within the comparator to achieve a linear temperature variation for the oscillator;

FIG. 29 illustrates the use of a programmable transistor array to control the temperature variation curvature;

FIG. 30 illustrates the operation of a comparator having a digitally programmable temperature variation curve;

FIG. 31 illustrates a further embodiment of the band-gap generator enabling programmability of the temperature coefficients of the band-gap reference voltage;

FIGS. 32 a-32 d is a schematic diagram of the band-gap generator;

FIG. 33 is a functional block diagram of the frequency trimming on-the-fly functionality of the oscillator;

FIG. 34 is a flow diagram illustrating the process for frequency trimming on-the-fly for the oscillator based upon temperature;

FIG. 35 illustrates the separate coarse and fine tune frequency trimming of the capacitor within the RC circuit of the oscillator;

FIG. 36 is an illustration of the coarse capacitor array;

FIG. 37 is a schematic diagram of the fine capacitor array; and

FIG. 38 is a schematic diagram of the temperature capacitor array.

FIG. 39 is an illustration of an implementation of a LINBUS network;

FIG. 40 is a block diagram of the LINBUS communications interface;

FIG. 41 is a flow diagram illustrating the manner in which data is transmitted through the LINBUS communications interface;

FIG. 42 illustrates the LINBUS address register;

FIG. 43 illustrates the LINBUS data register;

FIG. 44 illustrates the LINBUS control mode register; and

FIG. 45 illustrates the remaining LINBUS registers.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawings, wherein like reference numbers are used herein to designate like elements throughout the various views, embodiments of the present invention are illustrated and described, and other possible embodiments of the present invention are described. The figures are not necessarily drawn to scale, and in some instances the drawings have been exaggerated and/or simplified in places for illustrative purposes only. One of ordinary skill in the art will appreciate the many possible applications and variations of the present invention based on the following examples of possible embodiments of the present invention.

Referring now to FIG. 1, there is illustrated an integrated circuit that is comprised of a fully integrated mixed-signal System on a Chip with a true 12-bit multi-channel ADC 110 with a programmable gain pre-amplifier s12, two 12-bit DACs 114 and 116, two voltage comparators 118 and 120, a voltage reference 22, and an 8051-compatible microcontroller corel 24 with 32 kbytes of FLASH memory 126. There is also provided an 12C/SMBUS 128, a UART 130, and an SPI 132 serial interface 140 implemented in hardware (not “bit-banged” in user software) as well as a Programmable Counter/Timer Array (PCA) 134 with five capture/compare modules. There are also 32 general purpose digital Port I/Os. The analog side further includes a multiplexer 113 as operable to interface eight analog inputs to the programmable amplifier 112 and to the ADC 110.

With an on-board V_(DD) monitor 136, WDT, and clock oscillator 137, the integrated circuit is a stand-alone System on a Chip. The MCU effectively configures and manages the analog and digital peripherals. The FLASH memory 126 can be reprogrammed even in-circuit, providing non-volatile data storage, and also allowing field upgrades of the 8051 firmware. The MCU can also individually shut down any or all of the peripherals to conserve power.

A JTAG interface 142 allows the user to interface with the integrated circuit through a conventional set of JTAG inputs 144. On-board JTAG emulation support allows non-intrusive (uses no on-chip resources), full speed, in-circuit emulation using the production integrated circuit installed in the final application. This emulation system supports inspection and modification of memory and registers, setting breakpoints, watch points, single stepping, run and halt commands. All analog and digital peripherals are fully functional when emulating using JTAG.

The microcontroller 140 is fully compatible with the MCS-51™ instruction set. Standard 803x/805x assemblers and compilers can be used to develop software. The core has all the peripherals included with a standard 8052, including three 16-bit counter/timers, a full-duplex UART, 256 bytes of internal RAM, 128 byte Special Function Register (SFR) address space, and four byte-wide I/O Ports.

Referring further to FIG. 1, the core 141 is interfaced through an internal BUS 150 to the various input/output blocks. A cross-bar switch 152 provides an interface between the UART 130, SPI BUS 132, etc., and the digital I/O output. This is a configurable interface. That can be associated with the V_(DD) monitor 136.

The core 140 employs a pipelined architecture that greatly increases its instruction throughput over the standard 8051 architecture. In a standard 8051, all instructions except for MUL and DIV take 12 or 24 system clock cycles to execute with a maximum system clock of 12 MHz. By contrast, the core 140 core executes seventy percent (70%) of its instructions in one or two system clock cycles, with only four instructions taking more than four system clock cycles. The core 140 has a total of 109 instructions. The number of instructions versus the system clock cycles to execute them is as follows:

Instructions 26 50 5 14 7 3 1 2 1 Clocks to Execute 1 2 2/3 3 3/4 4 4/5 5 8

With the core 140's maximum system clock at 20 MHz, it has a peak throughput of 20 MIPS.

As an overview to the system of FIG. 1, the cross-bar switch 152 can be configured to interface any of the ports of the I/O side thereof to any of the functional blocks 128, 130, 132, 134, 135 or 136 which provide interface between the cross-bar switch 152 and the core 140. Further, the cross-bar switch can also interface through these functional blocks 128-136 directly to the BUS 150.

Referring now to FIG. 2, there is illustrated a more detailed block diagram of the integrated circuit of FIG. 1. In this embodiment, it can be seen that the cross-bar switch 152 actually interfaces to a system BUS 202 through the BUS 150. The BUS 150 is a BUS as operable to allow core 140 to interface with the various functional blocks 128-135 in addition to a plurality of timers 204, 206, 208 and 210, in addition to three latches 212, 214 and 216. The cross-bar switch 152 is configured with a configuration block 220 that is configured by the core 140. The other side of the cross-bar switch 152, the I/O side, is interfaced with various port drivers 222, which is controlled by a port latch 224 that interfaces with the BUS 150. In addition, the core 140 is operable to configure the analog side with an analog interface configuration in control block 226.

The core 140 is controlled by a clock on a line 232. The clock is selected from, as illustrated, one of two locations with a multiplexer 234. The first is external oscillator circuit 137 and the second is an internal oscillator 236. The internal oscillator circuit 236 is a precision temperature and supply compensated oscillator, as will be described herein below. The core 140 is also controlled by a reset input on a reset line 154. The reset signal is also generated by the watchdog timer (WDT) circuit 136, the clock and reset circuitry all controlled by clock and reset configuration block 240, which is controlled by the core 140. Therefore, it can be seen that the user can configure the system to operate with an external crystal oscillator or an internal precision non-crystal non-stabilized oscillator that is basically “free-running.” This oscillator 236, as will be described herein below, generates the timing for both the core 140 and for the UART 130 timing and is stable over temperature.

Referring now to FIG. 3, there is illustrated a block diagram of the UART 130. A system clock is input to a baud rated generator 302 which provides a transmit clock on the line 304 and a receive clock on a line 306. The transmit clock is input to a transmit control block 308 and the receive clock is input to a receive control block 310. A serial control register (SCON0) 320 is provided that is operable to provide control signals to the control blocks 308 and 310. The transmit data is received from a bus 322 and is input through a gate 324 to a serial data buffer (SBUF) 326. The output of this data is input to a zero detector 328 and then to a control block 308. The system is an asynchronous, full duplex serial port device and two associated special function registers, a serial control register (SCON0) 320 and a serial data buffer (SBUF0) (not shown), are provided. Data is received on a line 312 and is input to an input shift register 314. This is controlled by the control block 310 to output the shifted-in data to a latch 332 and then through a gate 334 to an SFR bus 322. In transmit mode, data is received from an SFR bus 321 and input through a gate 324 to a transmit shift register 326 which is output to a transmit line 319 from the register 326 or from the control block 308 through an AND gate 338 which is input to one input of an OR gate 340 to the transmit line 319. This is all controlled by the control block 308.

Referring now to FIG. 3A, there is illustrated a block diagram of the baud rate generator 302. This baud rate is generated by a timer wherein a transmit clock is generated by a block TL1 and the receive clock is generated by a copy of the TL1 illustrated as an RX Timer, which copy of TL1 is not user-accessible. Both the transmit and receive timer overflows are divided by two for the transmit clock and the receive clock baud rates. The receive timer runs when timer 1 is enabled, and uses the same TH1 value, this being a reload value. However, an RX Timer reload is forced when Start Condition is detected on the receive pin. This allows a receipt to begin any time a Start is detected, independent of the state of the transmit timer.

Referring now to FIG. 4, there is illustrated a diagrammatic view of the precision internal oscillator 236 that is disposed on integrated circuit. The integrated circuit, as noted hereinabove, is a commercially available integrated circuit that incorporates the precision oscillator 236 in association therewith. The integrated circuit provides the capability of selecting a crystal oscillator wherein a crystal is disposed between two crystal ports, selecting an external clock signal or selecting an internal free-running oscillator. The free-running oscillator is illustrated in FIG. 4 as the precision oscillator 236. At the center of the oscillator are two comparators, a first comparator 402 and a second comparator 404. A temperature compensated voltage reference circuit 406 is provided that provides a temperature compensated voltage reference (the trip voltage V_(TRIP)) to the negative inputs of the comparators 402. The outputs of the comparators 402 and 404 are connected to the Set and Reset, respectively, inputs of an S/R latch 408. The Q and Q-Bar outputs thereof are input to an output RC timing circuit 410 that is operable to define the period of the oscillator, the output of the S/R latch 408 providing the output clock signal. The output of this RC timing circuit 410 is fed back to the positive inputs of the comparators 402 and 404. The output RC timing circuit 410 is also temperature compensated. As will be described herein below, the voltage reference block 406 provides a negative temperature coefficient, whereas the comparators 402 and S/R latch 408 combination provide a positive temperature coefficient and the output RC timing circuit 410 provide a positive temperature coefficient. The overall combined coefficient will be approximately zero, as will be described herein below.

Referring now to FIG. 5, there is illustrated a more detailed diagrammatic view of the precision oscillator of FIG. 4. The voltage reference circuit 406 is comprised of a voltage divider that divides the supply voltage V_(DD) to a voltage V_(TRIP) on a node 502. The voltage divider is comprised of a top resistor 504 labeled R₃. The bottom half of the voltage divider is comprised of two parallel resistors, a resistor 506 labeled R₂ and a resistor 508 labeled R₄. For nomenclature purposes, the resistors will be referred as R₂, R₃ and R₄.

Resistors R₃ and R₄ are fabricated from the same material to provide a positive temperature coefficient. These are fabricated from the N-diffusion material, which has a positive temperature coefficient. By comparison, R₂ is manufactured from polycrystalline silicon in the first layer which is referred to as Poly1 material, and which also has a positive temperature coefficient, but which differs. It should be understood that different materials could be utilized, it only being necessary that there be two resistors having different temperature coefficients. Although not a part of this disclosure, Poly1 material is basically the first layer of polycrystalline silicon that is disposed on the substrate over a protective oxide layer, from which such structures as the gates of transistors are fabricated. With the positive temperature coefficients of the resistors, this will result in the voltage V_(TRIP) having a negative coefficient. As will be described herein below, the resistors being of different materials facilitates adjustments between the two resistors R₂ and R₄ to vary the temperature coefficient. This is primarily due to the fact that they are of differing materials.

The output RC timing circuit 410 is comprised of two RC circuits. The first RC circuit is comprised of a P-channel transistor 520 having the source/drain path thereof connected between V_(DD) and one side of a resistor 522 labeled R, the other end thereof connected to a node 524. Node 524 is connected to one side of a capacitor 526, the other side of the capacitor 526 connected to V_(SS). —channel transistor 528 has the source/drain path thereof connected across capacitor 526, and the gate thereof connected to the gate of P-channel transistor 520 and also to the Q-output of the S/R latch 408. Node 524 comprises the positive input of the comparator 402. The second RC network is comprised of a P-channel transistor 530 having the source/drain path thereof connected between V_(DD) and one side of a resistor 532 (labeled R), the other side of resistor 532 connected to a node 534. Node 534 is connected to one side of a capacitor 536, the other side thereof connected to V_(SS). An N-channel transistor 538 has the source/drain path thereof connected between node 534 and V_(SS). The gate of transistor 538 is connected to the gate of transistor 530 and also to the Q-Bar output of S/R latch 408. The node 534 comprises the positive input of the comparator 404. The output waveform for the circuit of FIG. 5 is illustrated in FIG. 6, wherein conventional RC rise and fall curves are illustrated for each of the RC circuits. The period of each output waveform is defined from the initial turn-on point where voltage is applied to the resistor R to the point where resistor R of the other of the RC circuits is turned on. There will be period T1 and a period T2 for each of the RC circuits, respectively. The sum of the two periods is equal to the period for the oscillator. Transistors 520, 530, 528 and 538 are sized such that their resistances are substantially less than the value of resistors 522 and 532. The resistors 522 and 532 are fabricated from Poly1 material due to its low temperature coefficient. The period of the oscillator is the sum of the period T1 and the period T2+2 times the delay of the comparators.

Referring now to FIG. 7, there is illustrated more detailed block diagram of the implementation of the voltage reference 406. The resistor 504 which is illustrated in FIG. 5 as being connected to V_(DD) is actually connected through the source/drain of the P-channel resistor 702 to V_(DD) with the gate thereof connected to a bias voltage. Similarly, the bottom end of resistor 506 is connected to V_(SS) through the source/drain path of a N-channel transistor 706 to V_(SS), the gates of both transistors 704 and 706 connected to a bias. Transistors 702, 704 and 706 are sized such that their resistances are substantially less than the value of resistors R₂, R₃ and R₄. Also, first order power supply independence comes from the fact that the trip voltage V_(Trip) is proportional to the supply voltage, i.e., V_(DD*)(1−e(t/τ)). Therefore, in the time it takes to reach the trip voltage at the input of the comparator is supply independent to the first order. This is one reason that the RC timing circuits are utilized rather than a current source charging a capacitor, which does not provide the first order cancellation. V_(Trip)=V_(DD)*ratio V_(Trip)=V_(DD)*(1−e(−T1/τ)) T1=−τ*1n(1−V_(Trip)/V_(DD) Thus: T1=−τ*1n(1−ratio)

From a temperature compensation standpoint, there are a number of aspects of the voltage reference circuit 406 that can be utilized to provide temperature compensation. Commonly, the resistors have a set variation with respect to temperature. The Poly1 resistor R₂ has a temperature coefficient of 255 ppm whereas the N-diffused resistors R₃ and R₄ have a temperature coefficient of 800 ppm. In the present disclosure, it is desirable to have a negative coefficient of 462 ppm.

To analyze how a negative temperature coefficient is created with the resistors R₂, R₃ and R₄, consider that R₂ and R₄ are a parallel combination defined as REQ=R₂//R₄. If REQ and R₃ have different temperature coefficients with TCR₃>TCREQ, then the trip voltage will have a negative temperature coefficient. V_(TRIP) will be defined as follows:

$\quad\begin{matrix} {V_{TRIP} = {\frac{REQ}{R_{3} + {REQ}}V_{DD}}} \\ {{\frac{1}{V_{TRIP}}\frac{\mathbb{d}V_{TRIP}}{\mathbb{d}T}} = {{\frac{1}{REQ}\frac{\mathbb{d}{REQ}}{\mathbb{d}T}} - {\frac{R_{3}}{R_{3} + {REQ}}\left\lbrack {\frac{1}{REQ}\frac{\mathbb{d}{REQ}}{\mathbb{d}T}} \right\rbrack} -}} \\ {\frac{R_{3}}{R_{3} + {REQ}}\left\lbrack {\frac{1}{R_{3}}\frac{\mathbb{d}R_{3}}{\mathbb{d}T}} \right\rbrack} \\ {{\frac{1}{V_{TRIP}}\frac{\mathbb{d}V_{TRIP}}{\mathbb{d}T}} = {\frac{R_{2}}{R_{3} + {REQ}}\left\lbrack {{TCREQ} - {TCR}_{3}} \right\rbrack}} \end{matrix}$

For REQ, is must be assumed that V_(TRIP) is a fixed value, such that R₂ and R₄ can be varied to target a specific temperature coefficient. This can be shown by the following equations:

$\quad\begin{matrix} {{\frac{1}{REQ}\frac{\mathbb{d}{REQ}}{\mathbb{d}T}} = {\left\lbrack {\frac{1}{R_{2}}\frac{\mathbb{d}R_{2}}{\mathbb{d}T}} \right\rbrack + \left\lbrack {\frac{1}{R_{4}}\frac{\mathbb{d}R_{4}}{\mathbb{d}T}} \right\rbrack -}} \\ {{\frac{R_{2}}{R_{2} + R_{4}}\left\lbrack {\frac{1}{R_{2}}\frac{\mathbb{d}R_{2}}{\mathbb{d}T}} \right\rbrack} - {\frac{R_{4}}{R_{2} + R_{4}}\left\lbrack {\frac{1}{R_{4}}\frac{\mathbb{d}R_{4}}{\mathbb{d}T}} \right\rbrack}} \\ {{TREQ} = {{TCR}_{2} + {TCR}_{4} - {\frac{R_{2}}{R_{2} + R_{4}}{TCR}_{2}} - {\frac{R_{4}}{R_{2} + R_{4}}{TCR}_{4}}}} \end{matrix}$ The results of equation 5 can be utilized in equation 3 to set the final temperature coefficient of V_(TRIP).

Referring now to FIG. 8, there is illustrated a detailed diagram of the implementation of one-half of the charging structure 410. This, as with the case with respect to the voltage reference structure 406, there is provided a P-channel transistor 802 for connecting the top end of the resistor 522 to V_(DD,), with the gate thereof connected to a bias supply. This P-channel transistor introduces very little error in the temperature operation thereof. Capacitor 526 is a variable capacitor, such that the value thereof can be varied to set the period for the oscillator. The capacitor 526 is fabricated from an insulator disposed between the first layer poly, P1, and the second layer poly, P2, with a layer of oxide disposed there between. The resistor 522 is an N-diffusion resistor.

The resistors R₃, R₂ and R₄ in the voltage reference circuit 406 are variable resistors that can be mask programmable resistors. Resistor R₃ is utilized to set the value of V_(TRIP) and resistors R₂ and R₄ are utilized to select a temperature coefficient, since they have dissimilar temperature coefficients.

FIG. 9 illustrates a layout for one of the resistors R₂-R₄. A plurality of series connected resistors are provided that are fabricated in either the substrate with an N-type diffusion or in the Poly1 layer. These resistors provide a mask programmable set of connections 904 to allow one or more resistors 902 to be added into the resistor string, they being initially shorted out. Although not shown, there is also provided the ability to short additional ones of the resistors to decrease the value. This is mask programmable and is utilized to “tweak” the design at the metal level.

Referring now to FIG. 10, there is illustrated a diagrammatic view of the capacitor 526, which is a register programmable capacitor to allow for adjustment of the center frequency. There is provided a nominal capacitor 1002 which has a value of 380 fF, which is connected between node 24 and V_(SS). In parallel therewith, there is also provided a mask programmable capacitor 1004 that provides for eight steps of programming in increments of 39.5 fF. The register programmable capacitors are provided with a capacitor 1006 of value “C” that is connected between a node 524 and one side of the source/drain path of an N-channel transistor 1008, the gate thereof connected to the LSB bit. The configuration of the capacitor 1006 disposed between the switching transistor 1008 and the node 524 is only used for LSB. This structure allows the use of the smaller unit capacitor, but there is some non-linear capacitance that is introduced from the source/drain of the transistor 1008 and, also, the wire bonds. The remaining selectable capacitors are each comprised of a capacitor 1010 which is connected between V_(SS) and one side of the source/drain path of an N-channel transistor 1012, the other side thereof connected to node 524 and the gate thereof connected to the bits [1] through [6]. The value of the capacitor 1010 associated with bit <1> is a value of “C”, with the next selectable capacitor 1010 having the associated transistor gate connected to the bit value <2>and the last of the selectable capacitor 1010 having the gate of the associated transistor connected to the bit <6> and a value of 32 C. This is a binary tree, with the LSB providing an LSB of approximately C/2.

Referring now to FIG. 11, there is illustrated a diagrammatic view of the differential input structure for each of the comparators 402 and 404. There are provided two differential P-channel transistors 1102 and 1104 having one side of the source/drain paths thereof connected to a node 1106, node 1106 connected through a current source 1108 to V_(DD). The other side of the source/drain path of transistor 1102 is connected to a node 1110 and the other side of the source/drain path of transistor 1104 is connected to a node 1112. The gate of transistor 1102 comprises the positive input and the gate of transistor 1104 comprises the negative input connected to V_(REF). Node 1110 is connected to one side of the source/drain path of an N-channel transistor 1114 and the gate thereof, the other side of the source/drain path of transistor 1114 connected to V_(SS). Node 1112 is connected to one side of the source/drain path of an N-channel transistor 1116, the other side thereof connected to V_(SS) and the gate thereof connected to a node 1118, node 1118 connected to one side of a resistor 1120, the other side thereof connected to the gate of transistor 1114. Node 1112 is also connected to the gate of an N-channel transistor 1122, the source/drain path thereof connected between node 1118 and V_(SS). This structure is referred to as a modified Flynn-Lidholm latching comparator which provides a Set/Reset latch with dynamic logic, described in Flynn M. Lidholm S. U., “A 1.2 μm CMOS Current Controlled Oscillator, IEEE Journal of Solid state Circuits,” Vol. 27 No. 7 July 1992.

Referring now to FIG. 12, there is illustrated a diagrammatic view of the comparator 402 and one-half of the S/R latch 408 illustrating the Q-Bar output. The one-half of the S/R latch 408 has the Set input thereof connected to the output of comparator 402 and input to the gate of an N-channel transistor 1202, the source/drain path thereof connected between a node 1204 and V_(SS). A P-channel transistor 1206 has the source/drain path thereof connected between node 1204 and V_(DD), the gate thereof connected to a node 1208. Node 1204 is connected to the input of a conventional inverter 1210 and also to one side of the source/drain path of an N-channel transistor 1212, the other side thereof connected to V_(DD) and the gate thereof connected to a node 1214, which node 1214 is also connected to the output of inverter 1210. Node 1214 is connected to the input of an inverter 1216, the output thereof providing the Q-Bar output. Node 1214 also is connected through a delay block 1218 to the input of a NAND gate 1220 labeled “ND1.” NAND gate 1220 is comprised of a P-channel transistor 1222 having the source/drain path thereof connected between V_(SS) and the node 1208 and an N-channel transistor 1224 having the source/drain path thereof connected between the node 1204 and one side of the source/drain path of an N-channel transistor 1226, the other side thereof connected to V_(SS). The gates of transistors 1222 and 1224 are connected to the output of the delay block 1218. The gate of transistor 1226 is connected to the reset input “RST” from the other side of the S/R latch 408. Node 1208 is connected to the input of an inverter 1230, the output thereof driving the gate of an N-channel transistor 1232 having the source/drain path thereof connected between the output of the comparator 402, the SET input of latch 408, and the other side of the source/drain path of transistor 1232 connected to V_(SS). The parallel structure to that associated with the output of comparator 402 in FIG. 12 is provided for the output of comparator 404 for the Reset input.

In operation, when the positive input of comparator 402, FB1, charges up, SET starts to go high. As it reaches the threshold voltage V_(TH) of transistor 1202, Q-Bar begins to go low and, at the same time, the other side of the latch, which has a NAND gate ND2 similar to ND1, begins to go low and pulls down RST. When RST is pulled down, this then sets the Q-output. Initially, it is assumed that Q-Bar is set to a value of “1” and the Q-output is set to “0” with FB1 equaling “0” on comparator 402 and FB2 on the positive input of comparator 404 being initially set to “1” with SET=0 and RST=1. The delay block 1218 prevents ND1 from pulling down the SET value before RST goes low. RST going low ensures that the pull down input is low (or ND1 high) to result in a symmetric process for SET/RST.

Referring now to FIG. 13, there is illustrated a schematic diagram of the delay block 1218. This delay block is comprised of a plurality of series connected invertors comprised of two series connected transistors, a P-channel transistor 1302 and an N-channel transistor 1304, with the gates thereof connected together and one side of the source/drain path thereof connected to a node 1306, transistor 1302 connected between V_(DD) and V_(SS).

Referring now to FIG. 14, there is illustrated a diagrammatic view of a simplified comparator illustrating how supply independence is enhanced. The comparator of FIG. 14 is illustrated with a current source 1402 disposed between V_(DD) and a node 1404, node 1404 connected to one side of two differential connected P-channel transistors 1406 and 1408. The gate of transistor 1406 is connected to one input, whereas the gate of transistor 1408 is connected to the other V_(REF) input. The other side of the source/drain path of transistor 1406 is connected to a node 1410, which is connected to one side of the source/drain path of an N-channel 1412, the other side thereof connected to ground and the gate thereof connected to both the drain thereof on node 1410 and to the gate of an N-channel transistor 1414. Transistor 1414 has the source/drain path thereof connected between the other side of transistor 1408 and V_(SS). Additionally, an offset transistor(s) 1416 of the P-channel type has the source/drain path thereof connected across the source/drain path of transistor 1408, the gate thereof connected to V_(REF) and also to the gate of transistor 1408. Transistor 1416 represents selectable transistors that are mask programmable to select a predetermined offset in the comparator. This offset at the input of the comparators aid in the supply independence. Without offset, the following would be true:

With offset: T _(Period)=2*(−τ*1n(1−V_(TRIP) /V _(DD))+T _(Delay(comp))) T _(period)−2*(−τ*1n−ratio)+T _(Delay(comp)) V_(TRIP)=ratio*V_(DD) Without offset: V_(TRIP)=V_(TRIP)+V_(OS) T _(Period)=2*(−τ*1n(1−ratio−V_(OS)/V_(DD))+T _(Delay(comp))) From these equations, it can be seen that V_(DD) dependence has been added. Power supply dependence can be added or subtracted by varying the transistors 1416, noting that there could be variable transistors across transistor 1406 also. This way, the offset can be made negative or positive. Again, this is a mask programmable system.

Referring now to FIG. 15, there is illustrated a diagrammatic view of one instantiation of the precision oscillator. In the oscillator implemented on the integrated circuit, a programmable internal clock generator 2402 is provided that is controlled by a register 2406 and a register 2408. The output of the internal clock generator is input to a divide circuit 2410, which is also controlled by the register 2408, the output thereof being input to one input of a multiplexer 2410. This multiplexer 2410 is controlled by the register 2408. Register 2410 outputs the system clock (SYSCLK), which is input to the baud rate generator 302. In addition to an internal clock generator, there is also a provision for an external crystal controlled oscillator. A crystal controlled internal or on-chip oscillator 2412 is provided that is interfaced through an input circuit 2414 to terminals 2416 and 2418 to an external crystal 2416. The output of the oscillator 2412 is input to one input of the multiplexer 2410. Additionally, an external clock is provided on a terminal 2420 that is also input to one input of the multiplexer 2410. The crystal controlled oscillator 2412 is controlled by a register 2422.

The internal oscillator 2402 is provided such that it will be the default system clock after a system reset. The internal oscillator period can be programmed with the register 2406 by the following equation:

${\Delta\; T} \cong {0.0025 \times \frac{1}{f_{BASE}} \times \Delta\;{OSCICL}}$ wherein f_(BASE) is a frequency of the internal oscillator followed by a reset, ΔT is the change in internal oscillator, and ΔOSCICL is a change to the value held in the register 2406. Typically, the register 2406 will be factory calibrated to a defined frequency such as, in one example, 12.0 MHz.

Referring now to FIG. 16, there is illustrated a table for register 2406 wherein it can be seen that bits 6-0 are associated with the calibration register of the oscillator and its value can be changed internally. FIG. 17 illustrates the control register 2408 illustrating the controls provided therefor.

The use of digitally programmable resistor networks is proposed for the purpose of increasing the frequency stability of oscillators, in particular with respect to temperature drift and supply voltage variation, so that these oscillators may approach the frequency stability of crystals. In this way, the entire oscillator assembly may be integrated on-chip. The proposed programmable resistor networks are constructed in special topologies from integrated resistors of differing materials and from integrated transistors used as switches. Associated digital logic is also included to control the special switching sequence that is required. These programmable resistor arrays are used as one means to increase the frequency stability of a fully-integrated free-running oscillator beyond what is required simply for UART operation, and to instead achieve a much more precise frequency stability of +/−0.5% in order to meet stricter CAN (Control Area Network) specifications—in the presence of variations in temperature from −40 C. to 125 C., variations in supply voltage from 1.8V to 3.6V, and variations in component manufacturing of various types.

Referring now to FIG. 18, there is provided a further illustration of the precision oscillator 236 with an alternative and improved embodiment of the voltage reference circuit 406. As before, there are two bottom resistors 1804 and 1806 designated R2 and R4 respectively, making up two independent arrays. In this implementation, however, there are also two top resistors in parallel, as opposed to just one, forming what will be considered a single resistor array 1802 designated R3=R2prime∥R4prime. R2prime is chosen to be the same material as R2, and R4prime is chosen to be the same material as R4. Also, R2prime and R4prime are chosen to be a factor of K times the value of R2 and R4 respectively on their nominal programmed settings, i.e. R2prime=K*R2 and R4prime=K*R4, where the value of K is the same in both equations. As a result of these choices, process variations in R2prime∥R4prime will track and approximately cancel process variations in R2∥R4, and thus the overall process variation of the voltage reference temperature coefficient is significantly reduced compared to the case where the top resistor consists of only a single resistive material. Also, in this implementation, each of the three resistor arrays R3=R2prime∥R4prime, R2, R4, is made digitally programmable in its resistance value.

As before, the voltage reference circuit 406 is connected to the negative inputs of comparators 402 and 404. The outputs of comparators 402 and 404 are connected to the S and R inputs of an SR latch 408. The Q and Q-Bar outputs of the SR latch 408 are connected to the RC timing block circuit 410. The RC timing block circuit 410 consists of the transistors 802, 802′, resistor 522, 522′, variable capacitor 526, 526′ and transistor 528, 528′ as was described previously with respect to FIG. 8.

The digitally programmable resistor arrays, consisting of resistors R3=R2prime∥R4prime, R2, and R4, comprising the digitally programmable resistor divider network are configured to minimize the effects of end resistance, switch resistance, and sub-threshold leakage currents of switches on the overall temperature coefficient generated by the resistor divider network. These three effects add significant process variation and non linearity to what would otherwise be a very linear and well-controlled temperature coefficient of the resistor divider network, as well as making this temperature coefficient larger in value than it would otherwise be. Process variation and non linearity of the resistor voltage divider temperature coefficient directly translate into process variation and non linearity of the overall oscillator temperature coefficient. The overall accuracy of this particular implementation of the precision oscillator must go beyond what is required simply for UART operation, and instead achieve a much more precise frequency stability of +/−0.5 percent from −40 C. to 125 C., in order to meet stricter CAN (Control Area Network) specifications. Since it is very expensive to trim the temperature coefficient of each part individually—because this requires heating and/or cooling the part in an accurate temperature-controlled environment—this +/−0.5% accuracy budget must also include the part-to-part variation of the overall oscillator temperature coefficient.

Switches connected to resistors must be implemented as MOS devices in the triode region of operation, which have high, nonlinear, poorly-controlled temperature coefficients that degrade the otherwise low, linear, well-controlled temperature coefficients of the programmable resistor array—making it difficult to compensate for the temperature coefficient of the overall oscillator in a PTAT/CTAT fashion. In order to control this, the topology of the resistor network is designed so that the ratio of total pure resistance to total end/switch resistance on any particular programmable setting is always kept large enough that the temperature coefficient contribution from the total end/switch is negligible in the weighted sum. The weighted-sum equation for a resistor temperature coefficient is given by: TCres=[2*Rend/(Rpure+2*Rend)]*TCend+[Rpure/(Rpure+2*Rend)]*TCpure, where the weighting is the respective fraction that end resistance and pure resistance contribute to the overall series combination. The factor of 2 occurs in the equation, because there is 1 parasitic end resistance on each side of the pure resistance, making a total of 2 end resistances per 1 pure resistance, for each resistor.

For P+ non-silicided poly resistors in a typical 0.18 μm process, such as those used in the programmable R4 array, pure resistances have tempcos of −75 ppm/C, while end resistances have tempcos of −1692 ppm/C. In this case, the pure resistance tempco is much smaller than the end resistance tempco, so end resistances have a major impact on the overall temperature coefficient of the P+ resistors used in the R4 array. Moreover, the value of these end resistors can vary by as much as +/−50% from one chip to another, causing the overall temperature coefficients of the P+ poly resistors to vary significantly, as predicted by the previous weighted-sum equation. For this reason, all P+ poly resistors are implemented in parallel within the programmable R4 resistor array, so that only one resistor in the parallel combination is connected for a given setting, while all other parallel resistors are disconnected from the array, as will be explained. In this way, the R4 resistor array has only two end resistances and one pure resistance contributing to the overall resistance on any particular programmable setting. If each of the P+ poly resistors in the array are then made long enough and wide enough in the design, such that the value of the pure resistance is made orders of magnitude greater than the value of the two end resistances, then the overall resistor temperature coefficient will be very close to the well-controlled value of −75 ppm/C, as desired.

For N+ non-silicided poly resistors in a typical 0.18 μm process, such as those used in the programmable R2 array, pure resistances have tempcos of −1184 ppm/C, while end resistances have tempcos of −1372 ppm/C. In this case, the pure resistance tempco is much closer in value to the end resistance tempco, so the end resistances have a less significant impact on the overall temperature coefficient of the N+ poly resistors in R2 than they did in the case of the P+ poly resistors in R4 . Although the +/−50% variation of the end resistor values still presents a problem, it is also to a lesser degree in this case, as again predicted by the weighted-sum equation. As a consequence of these facts, the N+ poly resistors do not need to be implemented in parallel, but can instead be implemented in series, where a certain number of N+ poly resistors are added and subtracted from the total series sum for any given setting. This approach saves area compared to the parallel approach and is therefore preferred when end and pure resistor values are relatively close in value. The parallel approach is preferred when extremely low and well-controlled resistor tempcos need be achieved at the expense of area, as in the case of the R2 array.

Referring now to FIGS. 19 a and 19 b, there are illustrated a schematic diagram of the programmable resistor array making up the variable resistor R2 illustrated in FIG. 18. This programmable resistor array consists of a plurality of resistors 1902, implemented in this case with N+ non-silicided polysilicon material, which are connected in series between a first node 1904 and a second node 1906. Note that other resistive materials may also be used to implement these resistors, depending on the details of the particular fabrication process. Each transistor 1908 acts as a switch to disconnect its associated resistor 1902 from the array, having its drain node attached to the top of each resistor 1902 and its source node attached to special circuitry which limits the sub-threshold leakage of the switch when it is turned off, as will be explained. When each transistor 1908 is turned on, the top node of the associated resistor 1902 is shorted to the bottom node 1906 of the series resistor array through the leakage funnel circuitry 1910, effectively shorting out the associated resistor and all resistors succeeding it in the series array so that they do not contribute to the total series resistance. When each transistor 1908 is turned off, the associated resistor node is left free, so that the resistor 1902 can contribute to the overall series resistance of the variable resistor array, assuming all transistors preceding it in the array are also switched off. In this off state, the sub-threshold leakage of the switch 1908 is significantly reduced by the aforementioned special leakage funnel circuitry 1910. Note that the bulk node of each transistor within the programmable resistor array is connected to ground.

The following describes the sequence of turning on/off switches in the R2 array so as to program it to a particular resistance value. Assuming all switches are turned on to begin with, node 1904 is shorted to node 1906 through all of the switches and leakage circuitry, resulting in a resistance of zero. Next, the transistor switch closest to node 1904 is turned off. The top-most resistor in the series array, and only this particular resistor, is now connected between node 1904 and node 1906. Next this switch remains off, and the switch directly succeeding this switch in the array is turned off. The top-most resistor and the resistor directly succeeding it are now both connected in series between node 1904 and node 1906. Continuing this process, each time the next switch in sequence is turned off, an additional resistance is added to the series sum, until finally all resistors in the array are connected in series when all switches are turned off. Note that, at bare minimum for this scheme to work, only one switch really needs to be turned on for any given resistance setting, since it effectively shorts out all the switches succeeding it in sequence whether they are on or off. However, having all successive switches on in sequence, as described, results in a lower effective parasitic switch resistance to node 1906, and therefore less degrading effect from the high, nonlinear, and poorly-controlled switch resistance on the very low, linear, and well-controlled temperature coefficient of the series polysilicon resistors.

The “leakage funnel” 1910 consists, in one particular implementation, of three transistors 1914, 1916, 1918 forming the top branch of a tree, and a fourth transistor 1920 forming the root branch of the tree. The top-branch transistors 1914, 1916, 1918 have their drain/source path connected between associated groupings of transistor switches attached to the resistor array, hereafter referred to as leaves, and an intermediate node 1912 inside the tree. The root transistor 1920 has its drain/source path connected between intermediate node 1912 and the bottom node 1906 of the series resistor array. One skilled in the art would appreciate that the leakage funnel may include more or less than 2 levels of branches, with any number of transistors on the various branch levels and any number of switches acting as leaves attached to the resistor array, so long as a tree topology is formed that funnels leakage from a larger number of leaf transistors on the top-most level to a smaller number of root transistors on the bottom-most level.

A first transistor 1914 of the top branch of the leakage funnel 1910 has its drain connected to the source of each of the leaf transistors 1908 a within a first portion of the resistor array. A second transistor 1916 of the top branch of the funnel has its drain connected to the source of each of the leaf transistors 1908 b within a second portion of the resistor array. And a third transistor 1918 of the top branch of the funnel has its drain connected to each of the sources of the leaf transistors 1908 c within a third portion of the resistor array.

The previous paragraph described a leakage funnel that was implemented in an explicit fashion with branch transistors separate from the leaves of the resistor array. A leakage funnel can also be implemented in an implicit fashion within the array itself by generating the branches from leaves that will later be turned off in the previously described switching sequence. Such an implicit leakage funnel is implemented with transistor groupings 1908 d and 1908 e within a fourth and fifth portion of the resistor array. Leaf transistors 1908 d have their sources connected to the drain node of leaf transistor 1908 f within the array. When leaf transistor 1908 f is turned off in the switching sequence, it acts as the root branch of a tree with leaves consisting of the three transistors 1908 d which were turned off previously. As transistors succeeding 1908 f are subsequently turned off in sequence, extra branch levels are added to this tree, with a single transistor being added per new branch level. At the end of the sequence, when every switch in the array is ultimately turned off, transistor 1908 g becomes the final root of the tree.

Implicit leakage funnels can be profitably implemented at the end of the resistor array when the overall series poly resistance becomes very large, in which case the extra switch resistance introduced by the large number of extra branch levels can be tolerated with negligible effect on the very low, linear, and well-controlled temperature coefficient of the series poly resistance. Adding extra switch resistance towards the beginning of the array is problematic, because the total series resistance is very small and therefore easily affected by the high, nonlinear, and poorly controlled temperature coefficient of the switches. The advantage of implicit leakage trees is that they tend to do a better job of reducing leakage than explicit trees, as well as saving area and reducing the complexity of the required control logic. For these reasons, explicit leakage funnels are used at the beginning of the R2 array, and implicit leakage funnels are used at the end of the R2 array.

The control signals applied to the gates of the transistors within the R2 resistor array are provided in a manner such that the leakage currents of the transistors are minimized via the leakage funnels, and thus the impact on the temperature coefficient of the programmable resistor array is minimized. The transistors forming the switches in the digitally programmable resistor array illustrated in FIGS. 19 a and 19 b must be large enough (i.e. must be sized with big enough W/L) to keep their on-resistance relatively small, such that on any given setting, the on-resistance contributes negligibly compared to the pure part of the resistor. This on-resistance has a high nonlinear temperature coefficient, and varies greatly in value due to manufacturing. In modem submicron processes (e.g. a 0.18 μm process), when the transistors are turned off, they still draw a significant current since the sub-threshold leakage of the transistor is so large. Unfortunately, making the size of the transistor bigger to reduce on-resistance also has the adverse effect of increasing this leakage current. In a typical 0.18 μm process, given a choice of W/L=20 um/0.18 um for each switch, which is the required W/L to keep on-resistance sufficiently low, we are forced to endure sub-threshold leakage currents on the order of a few nano-amps per switch at 85 C.

The uncompensated temperature coefficient of the oscillator is roughly −70 ppm/C, which requires a PTAT temperature coefficient from a programmable resistor array of approximately +70 ppm/C to cancel out. To keep the overall power consumption of the oscillator low, the bias current within the programmable resistor array is on the order of a few 10's of micro-amps. With such a small bias current, leakage on the order of of a few nano-amps per switch, times ˜30 switches, will significantly perturb such a low temperature coefficient as +70 ppm/C. Additionally, these subthreshold leakage currents exhibit an exponential dependence on temperature and threshold voltage, adding significant non-linearity and process variation to the programmable resistor array's temperature coefficient.

The number of switches that are turned off at any particular time are controlled such that once a grouping of transistor switches has been turned off, one of the transistor switches associated with this grouping within the transistor funnel 1910 is also turned off. As a result, only the leakage current of a single transistor is affecting the temperature coefficient of the circuit for that particular grouping of switches, rather than the leakage current of every single transistor in the group.

This process is more fully illustrated in FIG. 20. Digital logic, implemented in Verilog code, controls the switching of the transistors in the trees and properly adjusts the funneling for different settings. The process begins at step 2002 wherein all of the switches are turned on and the programmable resistor array provides a resistance of zero. The first switch, closest to node 1904, is turned off at step 2004. Once this first switch has been turned off, a particular resistance associated with this first switch is provided by the programmable resistor array, and control passes to inquiry step 2010 where a determination is made if all switches within a particular group (i.e. a particular grouping of transistors connected to the same transistor of the funnel) are turned off. Thus, for example, a determination is made if all of the switches 1908 a and/or all of the switches 1908 b and/or all of the switches 1908 c have been turned off. If inquiry step 2010 determines that no groups have all their transistors turned off, control passes to inquiry step 2006. Inquiry step 2006 determines if the programmable resistor array is providing the desired resistance. If so, the process is completed at step 2008. Otherwise, if the desired resistance is not yet high enough, the next switch (directly succeeding the previous switch) is turned off at step 2012 and control passes back to step 2010.

If inquiry step 2010 determines that all of a particular group of switches have been turned off, then the associated funnel switch is turned off at step 2014. Thus, for example, if all of the switches 1908 a had been turned off, then switch 1914 would be turned off within the transistor funnel 1910. This has the effect of having the leakage current associated with switch 1914 being the only leakage current affecting the temperature coefficient of the programmable resistor array for the particular grouping of transistors 1908 a, rather than having the cumulative effect of the leakage current of all of the switches in 1908 a affecting the temperature coefficient. The process is similar for the switches 1908 b associated with switch 1916 and the switches 1908 c associated with switch 1918. Inquiry step 2016 determines if all three of the funnel transistor switches 1914, 1916 and 1918 have been turned off. If not, control passes back to step 2006 to determine if the desired resistance has been achieved. However, if inquiry step 2016 determines that each of the funnel switches 1914 through 1918 have been turned off, then the main funnel switch 1920 is also turned off at step 2018. This causes the leakage current provided by the entire group of switches consisting of transistors 1908 a, 1908 b and 1908 c to have the effect of only the single transistor 1920, rather than the cumulative effects of all of the transistors 1908 a, 1908 b and 1908 c. Control is then finally returned to inquiry step 2006 to determine if the desired resistance has been achieved. Note that no special control logic is required for the operation of the implicit leakage funnel implemented with transistors 1908 d and 1908 f. So long as the proper switching sequence in FIG. 20 is followed, the root branch transistors in 1908 f take care of shutting themselves off properly on relevant settings.

The above described funneling approach works well in cases where larger leakages on the order of a few nano-amps may be tolerated, but the area of the programmable resistor array needs to be conserved. Larger leakages may be tolerated in the case of the N+ poly R2 array because the tempco is a fairly large value of −1184 ppm/C. However, in the case of the P+ poly R4 network, leakage must be kept on the order of pico-amps or less, because the tempco is a very small −75 ppm/C. A second scheme will now be explained that achieves femto-amp sub-threshold leakage in a typical 0.18 um process, and that works extremely well in the case of the R4 array. The only drawback to this scheme is that it requires more area to implement.

Referring now to FIGS. 21 a and 21 b, there are illustrated the programmable resistor array forming the resistor R4. The programmable resistor array illustrated in FIGS. 21 a and 21 b includes a plurality of P+ non-silicided polysilicon resistors 2102 all in parallel with one another. Note that other resistive materials may also be used to implement these resistors, depending on the details of the particular fabrication process. For any given setting, control logic ensures that only one resistor is switched in and that the remaining resistors are all switched out. The switching is accomplished using the circuitry included inside box 2200, as will be described momentarily. Having one resistor switched in and 29 resistors switched out, on any given setting, creates a great deal of sub-threshold leakage current through the 29 switches that are off, assuming that the circuitry inside box 2200 were to be implemented with a single transistor switch. As already mentioned, for a 20 um/0.18 um regular VT transistor, this sub-threshold leakage is a few nano-amps per switch at 85 C in a typical 0.18 um process. Accounting for all 29 transistors that are off, total leakage current of around 100 nano-amps would be expected, which would significantly affect the required low +70 ppm/C. temperature coefficient of the voltage reference, given that the bias current in the resistor divider is only 10's of micro-amps.

To solve this problem, a new circuit termed a “low-leakage switch” is proposed as a one-to-one replacement for the leaky single transistor switches which would otherwise have to be used to switch in and out the parallel P+ poly resistors in FIG. 21. This new low-leakage switch is illustrated in FIG. 22. A top node 2202 is connected to the drain of transistor 2204 and to the P+ resistor associated with the low leakage switch 2200. The transistor 2204 has its drain/source path connected between node 2202 and node 2206. A pair of transistors 2208 and 2210 are connected in series between the gate and source of transistor 2204 to create a negative gate-to-source voltage when transistor 2204 is turned off, and thereby reduce the sub-threshold leakage current. The source/drain path of transistor 2208 is connected between VDD and node 2206. The drain/source path of transistor 2210 is connected between node 2206 and node 2212. The bulk of transistors 2204 and 2210 are connected to ground, and the bulk of transistor 2208 is connected to its drain. The gates of transistors 2204, 2208 and 2210 are connected to the output of NOR gate 2214. NOR gate 2114 receives an input signal SWITCH and an input signal PDN. The low leakage switches operate by pulling the source of transistor 2204 above its gate by a few hundred milli-volts when either of the two input signals SWITCH or PDN goes high. This results in a negative gate-to-source voltage (VGS) for switch 2204, which reduces the current leakage of 2204 from nano-amps to femto-amps in a typical 0.18 um process.

Referring now back to FIGS. 21 a and 21 b, there are illustrated the programmable resistor array, including the low leakage switch 2200 described in FIG. 22. In this case, a parallel connection of a plurality of resistors 2102 have a first end connected to a top node 2104 of the programmable resistor array. The second end of resistors 2102 are each connected to node 2102 of a low leakage switch 2200 as illustrated in FIG. 22. The node 2212 of low leakage switch 2200 is the output of the programmable resistor array. The low leakage switch approach works well in cases where leakage needs to be extremely small, but larger areas may be tolerated for the bigger low leakage switches. The “leakage funnel” scheme described in the context of the programmable R2 array and the “low leakage switch” scheme described above in the context of the programmable R4 array both operate together to eliminate the disastrous effects of leakage current on the temperature coefficient of the voltage reference network, and therefore on the temperature coefficient of the overall oscillator.

Referring now to FIG. 23, there is illustrated the programmable resistor array used to provide the variable resistor 1802 designated R3=R2prime∥R4prime in the voltage reference circuit of FIG. 18. As already explained, it has been determined that using a parallel combination of R2prime∥R4prime resistors—where R2prime is the same material as R2, where R4prime is the same material as R4, and where R2prime=K*R2 and R4prime=K*R4 with K being the same factor for both equations, provides a situation wherein the process variations of the top resistor array R2prime∥R4prime and bottom resistor arrays R2∥R4 tend to cancel each other out. The top resistors R3=R2prime∥R4prime are made digitally programmable to allow coarse tuning of the programmable voltage reference temperature coefficient, while the bottom resistors R2 and R4 are also each made separately digitally programmable to allow a fine tuning of the programmable voltage reference temperature coefficient. The coarse tuning is implemented in such a way as to triple the tuning range of the programmable resistor array beyond what could have been achieved via the fine tuning alone, while adding very little additional area.

The resistors 2302 comprise P+ poly resistors similar to the P+ poly resistors utilized in the programmable resistor array for variable resistor R4 . The resistors 2302 are connected in parallel with each other between a first node 2304 and second nodes 2306 a, 2306 b and 2306 c, respectively. The second nodes 2306 a, 2306 b and 2306 c are connected to the drains of a set of transistors 2308 a, 2308 b and 2308 c, respectively. The transistors 2308 a, 2308 b and 2308 c have their drain/source path connected between nodes 2308 a, 2308 b and 2308 c, respectively, and node 2310. The bulks of transistors 2308 are connected to ground. The gates of transistors 2308 are connected in such a way as to receive control bits from NOR gate 2312.

In parallel with the P+ poly resistors 2308 are N+ poly resistors 2330. The N+ poly resistors 2330 are in series with each other. A first transistor switch 2332 is used to turn on resistor 2330 a. Resistor 2330 a is connected between node 2334 and node 2336. Transistor 2332 has its source/drain path connected between node 2334 and node 2336. The bulk of transistor 2332 is connected to VDD and the gate of transistor 2332 is connected so as to receive a control signal from NAND gate 2338. Resistor 2330 b is connected between node 2336 and node 2340. Transistor 2342 is in series with resistor 2330 b and has its drain/source path between node 2340 and node 2310. The bulk of transistor 2342 is connected to ground, and the gate of transistor 2342 is connected to a control signal from NOR gate 2312. Transistor 2344 has its drain/source path connected between node 2334 and node 2310. The bulk of transistor 2344 is connected to ground, and the gate of transistor 2344 is connected to receive a control signal from NAND gate 2312. On any one of the three possible coarse tune settings, a P+ poly resistance is switched in on the left side and an N+ poly resistance is switched in on the right side.

By applying the desired control signals to the transistors of the R3 programmable resistor array, the R3 value is coarse-tuned such that the R4 prime P+ and R2prime N+ top resistors are set to one of three possible K-factor multiples of the corresponding R4 P+ and R2 N+ bottom resistors. In this way, the process variations of the top and bottom resistors tend to cancel each other out, regardless of the coarse tune setting.

Although the preferred embodiment has been described in detail, it should be understood that various changes, substitutions and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Referring now to FIGS. 24 a and 24 b, there are illustrated a schematic diagram of an additional embodiment of the SR latch 408. As described previously with respect to the SR latch 408, the inputs to the SR latch 408 comprise the SET input at node 2402 and the RESET input at node 2404. The comparator 402 is connected to node 2402, and the comparator 404 is connected to node 2404. A transistor 2406 has its drain/source path connected between node 2402 and ground. The bulk of transistor 2406 is connected to the source, and the gate of the transistor 2406 is connected to receive an input signal pdn. A transistor 2408 has its gate connected to node 2402. Transistor 2408 has its drain/source path connected between node 2410 and ground. The bulk of transistor 2408 is connected to its source. Transistor 2412 has its source/drain path connected between VDD and node 2410. The gate of transistor 2412 is connected to node 2414 designated PDSET_bar.

Transistor 2420 has its drain/source path connected between node 2402 and ground. The bulk of transistor 2420 is connected to its source. The gate of transistor 2420 is connected to node 2422 designated PDSET. Transistor 2424 also has its gate connected to node 2422. The source/drain path of transistor 2424 is connected between VDD and node 2414. The bulk of transistor 2424 is connected to its source. A series connection of transistors 2426 and 2428 are connected between VDD and ground. Transistor 2426 has its source/drain path connected between VDD and node 2422. Transistor 2428 has its drain/source path connected between node 2422 and ground. The bulk of transistor 2428 is connected to its source. The gates of transistors 2426 and 2428 are connected to node 2414. A transistor 2430 has its source/drain path connected between VDD and node 2414. Transistor 2432 has its source/drain path connected between VDD and node 2414. The bulk of transistor 2432 is connected to its source. The gate of transistor 2432 is connected to node 2434. Transistor 2436 is in series with transistor 2432 and has its drain/source path connected between node 2414 and node 2438. The bulk of transistor 2436 is connected to ground and the gate of transistor 2436 is connected to node 2434. Transistor 2440 is also in series with transistor 2436 and has its drain/source path connected between node 2438 and ground. The bulk of transistor 2440 is also connected to ground and its gate is connected to node 2442.

A delay box 2444 is connected between node 2434 and 2446. Transistors 2450 and 2452 have their drains connected to node 2446. The source/drain path of transistor 2450 is connected between VDD and node 2446. The drain/source of path transistor 2452 is connected between node 2446 and ground. The gates of transistors 2450 and 2452 are connected to node 2454. Transistor 2458 has its source/drain path connected between VDD and node 2460. Connected in series with transistor 2458 is transistor 2462 having its source/drain path connected between node 2460 and node 2454. The gate of transistor 2462 is connected to ground. The bulk of transistors 2462 and 2458 are connected to VDD. A transistor 2464 has its source/drain path connected between VDD and node 2454. The bulk of transistor 2464 is connected to VDD and the gate of transistor 2464 is connected to receive input pdnb. Node 2446 is connected to the gates of a series connection of transistors 2466 and 2468. Transistor 2466 has its source/drain path connected between ground and node 2470. Transistor 2468 has its drain/source path connected between node 2470 and node 2472. A transistor 2474 has its drain/source path connected between node 2472 and ground. A transistor 2476 has its drain/source path connected between node 2470 and VDD. Node 2470 comprises the output of the SR latch Q Bar.

The remainder of the latch circuit 408 is the same configuration as that just described for the reset input 2404 and Q output 2488. A transistor 2480 has its drain/source path connected between node 2404 and Vdd. The bulk of transistor 2480 is connected to the source, and the gate of the transistor 2480 is connected to receive an input signal pdnb. A transistor 2408′ has its gate connected to node 2404. Transistor 2408′ has its drain/source path connected between node 2410′ and ground. The bulk of transistor 2408′ is connected to its source. Transistor 2412′ has its source/drain path connected between VDD and node 2410′. The gate of transistor 2412′ is connected to node 2414′ designated PDRST_bar.

Transistor 2420′ has its drain/source path connected between node 2404 and ground. The bulk of transistor 2420′ is connected to its source. The gate of transistor 2420′ is connected to node 2422′ designated PDRST. Transistor 2424′ also has its gate connected to node 2422′. The source/drain path of transistor 2424′ is connected between VDD and node 2414′. The bulk of transistor 2424′ is connected to its source. A series connection of transistors 2426′ and 2428′ are connected between VDD and ground. Transistor 2426′ has its source/drain path connected between VDD and node 2422′. Transistor 2428′ has its drain/source path connected between node 2422′ and ground. The bulk of transistor 2428′ is connected to its source. The gates of transistors 2426′ and 2428′ are connected to node 2414′. A transistor 2430′ has its source/drain path connected between VDD and node 2414′. Transistor 2432′ has its source/drain path connected between VDD and node 2414′. The bulk of transistor 2432′ is connected to its source. The gate of transistor 2432′ is connected to node 2434′. Transistor 2436′ is in series with transistor 2432′ and has its drain/source path connected between node 2414′ and node 2438′. The bulk of transistor 2436′ is connected to ground and the gate of transistor 2436′ is connected to node 2434′. Transistor 2440′ is also in series with transistor 2436′ and has its drain/source path connected between node 2438′ and ground. The bulk of transistor 2440′ is also connected to ground and its gate is connected to node 2442′.

A delay box 2444′ is connected between node 2434′ and 2446′. Transistors 2450′ and 2452′ have their drains connected to node 2446′. The source/drain path of transistor 2450′ is connected between VDD and node 2446′. The drain/source of path transistor 2452′ is connected between node 2446′ and ground. The gates of transistors 2450′ and 2452′ are connected to node 2454′. A capacitor 2456′ is connected between node 2454′ and ground. Transistor 2458′ has its source/drain path connected between VDD and node 2460′. Connected in series with transistor 2458′ is transistor 2462′ having its source/drain path connected between node 2460′ and node 2454′. The gate of transistor 2462′ is connected to ground. The bulk of transistors 2462′ and 2458′ are connected to VDD. A transistor 2482 has its source/drain path connected between node 2454′ and ground. The bulk of transistor 2482 is connected to ground and the gate of transistor 2482 is connected to receive input pdn. Node 2446′ is connected to the gates of a series connection of transistors 2490 and 2486. Transistor 2490 has its source/drain path connected between node 2488 and node 2491. Transistor 2486 has its drain/source path connected between node 2488 and Vdd. A transistor 2492 has its drain/source path connected between node 2491 and ground. A transistor 2484 has its drain/source path connected between node 2488 and VDD. Node 2488 comprises the output of the SR latch Q.

By connecting th gates of transistors 2440 and 2440′ to nodes 2446 and 2446′ respectively, the operating speed of the SR latch is greatly increased. In prior art SR latch configurations, the gates of transistors 2440 and 2440′ were connected to the set node 2402 and reset node 2404, respectively. Connection of the gates of transistors 2440 and 2440′ to IQ and IQ Bar improves operation of the comparators 402 and 404 because this configuration cuts down on the load capacitance that the comparators must drive. IQ and IQ Bar are actually delayed versions of the SET and RESET signals. In order to account for the extra delay from SET to IQ and from RESET to IQ Bar, the delay boxes 2444 and 2444′ should be designed such that their delays are increased by at least a factor of 2. Only the delay through the nodes SET, SET-Bar, IQ and Q Bar on the left side and RESET, RESET-Bar, IQ Bar, Q on the right side actually enter into the period of an oscillation. This comprises a hidden form of memory bypass in the latch architecture. Thus, making the delay box longer has no adverse effect on the temperature coefficient of the oscillator, since it has no effect whatsoever on the frequency of oscillation.

By connecting an additional NMOS foot transistor to the transistor 2408 such that the source of 2408 connects to the drain of the foot transistor and the source of the foot transistor connects to ground, transistor 2408 may be turned on and off by the appropriate control signal to the gate of the foot transistor. Additional copies of this assembly of transistor 2408 and associated foot transistor may then be added in parallel such that all copies connect at node 2410 and node 2402 but are free from one another at all other nodes. By turning off different numbers of the copies via their respective foot switches, the curvature of the oscillator temperature coefficient can be digitally programmed. This is a mechanism by which curvature correction can be added to the oscillator.

Referring now to FIG. 25, there is a provided a schematic diagram of an alternative embodiment of the comparator circuits 402, 404. The inputs to the comparator circuit are provided at the input node 2502 and the Vref node 2504. The input node 2502 is connected to the gate of a transistor 2506. Transistor 2506 has its source/drain path connected between node 2508 and node 2510. A transistor 2512 has its source/drain path connected between node 2508 and node 2514. The gate of transistor 2512 is connected to the reference voltage input node 2504. Node 2514 also comprises the output node of the comparators 402, 404. A series connection of transistors 2516 and 2518 are connected between VDD and node 2508. Transistor 2516 has its source/drain path connected between VDD and node 2520. Transistor 2518 has its source/drain path connected between node 2520 and node 2508. The gates of transistors 2516 and 2518 are connected to receive signals ibias1 and ibias2, respectively. Transistor 2522 has its drain/source path connected between node 2510 and node 2524. The bulk of transistor 2522 is connected to ground. The gate of transistor 2522 is connected to node 2526. Transistor 2528 has its gate connected to receive input signal pdn. The drain/source path of transistor 2528 is connected between node 2510 and ground. Transistor 2530 has its gate connected to node 2526. The drain/source path of transistor 2530 is connected between node 2514 and node 2532. The output node 2514 is also connected to the gate of transistor 2534. Transistor 2534 has its drain/source path connected between node 2526 and node 2536. Transistor 2538 is connected in series with transistor 2534 and has its drain/source path connected between node 2536 and ground. The gate of transistor 2538 is connected to receive signal latchb.

Circuit 2540 connected to nodes 2524 and 2532 enables the offset voltage of the comparator 408 to be digitally program responsive to a six bit input signal applied to the gates of transistors 2542 through 2552. The circuit 2540 consists of a parallel combination of transistors 2542, 2544 and 2546, connected between node 2524 and ground, and a second parallel combination of transistors 2548, 2550 and 2552, connected between node 2532 and ground. The bulk of each of these transistors is connected to ground. The circuit 2540 provides programmable source degeneration to the current mirror, consisting of transistors 2522 and 2530, of the comparator. All of the transistors in 2540 operate in the triode region, and as such act as resistors. The sizing of transistors 2542-2552 is chosen such that the resistances on each side of the mirror are weighted in a binary fashion. By changing the ratio of degeneration resistance between the left and right sides of the mirror via the act of turning some transistors in 2542-2552 on and others off, the current gain of the mirror is altered from 1:1 to some other ratio. Hence the offset voltage of the comparator is adjusted, either positively or negatively, around a nominal value of zero when the resistances on both sides are equal.

The operation of the source degeneration circuit 2540 is more fully illustrated in the flow diagram of FIG. 26. The process is initiated at step 2602 and a determination is made if a positive or negative voltage offset is needed by the comparator at step 2604. If a positive voltage offset is to be applied to the comparator, the source degeneration resistance is increased on one side of the current mirror at step 2006 by turning off the associated transistors. The source degeneration resistance is decreased on the opposite side of the current mirror at step 2608 by turning on the associated transistors. The process is completed when the desired offset voltage is achieved at step 2609. The increase and decrease of the source degeneration resistance on opposite sides of the current mirror is achieved by turning off some of the triode transistors to increase source degeneration resistance or turning on some of the triode transistors to decrease source degeneration resistance. By source degenerating one side more than the other, the transfer ratio of the current mirror comprised of transistors 2522 and 2530 is changed, and thus the voltage offset of the comparator is changed. If inquiry step 2604 determines that a negative offset voltage is to be applied, the source degeneration is decreased on the first side of the current mirror at step 2610 and increased on the opposite side at step 2612. This is of course, the opposite of the process performed for a positive offset voltage increase. The process is completed at step 2609.

Referring now to FIG. 27, it can be seen how the voltage offset 2702 introduced by the source degeneration circuit 2540 is provided responsive to a six bit input signal. The first three bits 2704 control the transistors 2548 through 2552 on a first side of the current mirror comprised of transistors 2522 and 2530. A bit in a logical high state “1” turns on the associated transistor, and a bit in a logical low state “0” turns off the associated transistor. The second three bits 2706, control transistors 2542 through 2546 on a second side of the current mirror. These bits turn on and off the associated transistors in a similar fashion. While the present description has been with respect to a source degeneration circuit 2540 controlled by a six bit input signal, it should, of course, be realized that any number of fewer or greater transistors may be used for the source degeneration circuit 2540 to achieve a desired voltage offset.

Referring now back to FIG. 25, the latching transistor 2534 which latches the output node 2514 of the SR latch 408 to a desired state may be used to compensate for small non-linearities within the temperature coefficient of the RC network 410 of the oscillator circuit. In the embodiment illustrated in FIG. 25, this feature is controlled by an on/off switch consisting of transistor 2538 responsive to the control signal “latchb.” The temperature variation of the RC network 410 in the oscillator has a small curvature associated with it, as illustrated at 2802 in FIG. 28. This curvature cannot be fully compensated for in a PTAT/CTAT fashion by the programmable resistor arrays described herein in the earlier sections on the voltage reference network. By introducing a temperature coefficient with an appropriate curvature in the opposite direction within the comparators, the overall uncompensated temperature coefficient of the oscillator can be made more linear, and therefore more compensatable by the programmable resistor arrays described earlier. This is implemented by intentionally oversizing the latching transistor 2534 inside the comparator so that it becomes a dominating factor in the temperature coefficient variation. The disable switch 2538 enables the feature to be turned off if the temperature coefficient curvature compensation does not work well within the actual device. Thus, as it is illustrated in FIG. 28, the temperature coefficient curvature 2802 provided by the RC circuit is compensated for by the temperature coefficient curvature 2804 induced by the latch transistor 2534. This results in a temperature coefficient 2806 that is more linear since the curvature of the RC circuit 2802 and the curvature of the temperature coefficient 2804 of the transistor tend to cancel out each other.

Referring now to FIG. 29, this temperature coefficient current compensation feature may also be made digitally programmable to allow more precise control over the amount of curvature correction implemented by the latching switch. Thus, rather than using a single latching switch 2534 that is turned on and off by a switch 2538, a programmable latching transistor circuit 2902 may be utilized. The programmable latching circuit 2902 would be responsive to a multi bit input signal provided on control lines 2906. The multi bit control signal would select the latch transistor or transistors that most nearly provided the desired temperature coefficient curvature desired to cancel out the temperature coefficient curvature caused by the RC circuit. Thus, the programmable latching transistor circuit 2902 provides a variable temperature coefficient curvature responsive to the multi bit digital input. This would enable the situation illustrated in FIG. 30 wherein the temperature variation curvature 3002, provided by the RC circuit could be corrected by any number of selected temperature coefficient curvatures 3004 implemented by the programmable latching transistor circuit 2902 responsive to the input control signal. Therefore, if the amount of temperature coefficient curvature in the RC circuit should vary from one manufacturing lot to another, the programmable curvature correction can be used to adjust for each lot individually, so that all lots end up having linear temperature coefficients despite the variations.

One possible implementation of the programmable latching transistor circuit 2902 is now described. Connect additional copies in parallel of the assembly consisting of latching transistor 2534 and its associated foot transistor 2538 in FIG. 25, such that all copies short together at node 2526 and at node 2534 but are free from one another at all other nodes. By turning off different numbers of the copies via their respective foot switches (the gates of the foot switches would connect to the digital input lines 2906 in a one-to-one fashion), the curvature of the oscillator temperature coefficient can be digitally programmed. The addition and subtraction of these copies changes the effective drive strength of the latching transistor 2534, and therefore changes the curvature of the temperature coefficient.

Referring now to FIG. 31, there is illustrated a further embodiment of the band-gap generator 122 illustrated in FIG. 1. The temperature coefficients of the comparators 3102 and the regulated supply voltage 3104 within the oscillator may be controlled by providing the ability to digitally program the temperature coefficient of the band-gap reference voltage provided from the band-gap generator 122. The temperature coefficient of the band-gap reference voltage is programmed responsive to a digital control signal provided via input 3106. Having the ability to program the temperature coefficient of the band-gap reference voltage allows for precise control of the temperature coefficient of the comparators 3102 used in the oscillator and over the temperature coefficient of the regulated voltage supply 3104. By having control over the temperature coefficient of the comparators 3102 and regulated voltage 3104, the temperature coefficient variation of the entire oscillator circuit may be more closely controlled since the temperature coefficient variation of the comparators 3102 and regulated voltage supply 3104 is a chief source of temperature coefficient variations in the oscillator.

Referring now to FIGS. 32 a-32 d, there are more fully illustrated a schematic diagram of the band-gap generator 122. The band-gap generator 122 consists of start-up circuitry 3202, a PTAT generator 3204, a CTAT generator 3206 and the programmable temperature coefficient circuitry 3208. The programmable temperature coefficient circuitry 3208 is connected to the band-gap generator circuitry at node 3210. A gate of transistor 3212 is connected to node 3210 and its source/drain path is connected between VDD and node 3214. Transistor 3216 is connected in series with transistor 3212 and has its source/drain path connected between node 3214 and the output node of the band-gap generator 3218. A resistor array is connected to node 3218. The first part of the resistor array consists of a parallel combination of resistor 3220 and 3222 in series with another parallel combination of resistors 3224 and 3226. The resistor array next comprises a series connection of resistors 3228, 3230, 3232, 3234 and 3236. Resistors 3238 and 3240 have a first side connected to the bottom of resistor 3226 and a second end is connected to the CTAT generator at node 3242. A series combination of resistors 3244, 3246 and 3248 are connected between the end of resistor 3236 and node 3242. The CTAT generator 3206 is connected to the resistor array at node 3242. Note that all resistors in the bandgap are chosen to be the same unit size in order to achieve the best possible matching. To construct bigger resistors than the basic unit size, resistors of unit size must be placed in series. Similarly, to construct resistors of smaller size, resistors of unit size must be placed in parallel. It should therefore be understood that the exact configuration of resistors in the programmable tempco circuit can easily be changed if a different total resistance is required.

The gates of transistors 3212 are each connected to node 3210. The source/drain path of transistors 3212 are connected between VDD and node 3214. Transistors 3216 are connected in series with transistors 3212 and have their source/drain path connected between node 3214 and the output node 3218. The gates of transistors 3216 are connected to receive the trim signals trim 0 bar through trim 4 bar. Transistors 3217 have their source/drain path connected between node 3214 and the tops of resistors 3226, 3228 and 3234, respectively. Transistors 3217 a, 3217 b and 3217 c are connected to the top of transistors 3226, 3228, 3230. Transistors 3217 d and 3217 e are connected to the top of resistor 3234. The gates of transistors 3217 are connected to receive digital control signals trim 0 through trim 4, which are the inversed of 0 bar through 4 bar.

By controlling the digital signals applied to the inputs of transistors 3216 and 3217 (which are the inverses of one another), the user may digitally program the temperature coefficient of the band-gap reference voltage provided at the output node 3218. Transistors 3212 form individual legs of the output side of a current mirror, whose input side resides inside the PTAT generator. Transistors 3214 function as cascodes to improve the matching and power supply rejection of the mirror. Each of these transistor legs 3212 mirrors a weighted copy of the PTAT current, which is then dropped across a certain portion of the resistors in the resistor string. The total number of resistors that this current is dropped across differs from leg to leg. The weighting in the mirror legs is chosen in a binary fashion, by appropriately adjusting the number of fingers in each transistor. A net PTAT voltage is generated across the collective resistor string by adding up the individual IR (current times resistance) drops across each of the individual resistor segments in the resistor string. This net PTAT voltage then adds to the CTAT voltage generated by the emitter-to-base voltage of the diode-connected PNP bipolar transistor 3206 to form a bandgap voltage at node 3218 which in theory has a zero temperature coefficient (ZTC). By turning on and off different legs in the current mirror, the amount of net PTAT voltage that gets added to the fixed CTAT voltage is made larger or smaller, and thus the bandgap voltage can be varied from being PTAT to being ZTC to being CTAT, and in this way is therefore digitally programmable. Note that in this scheme, the value of the CTAT voltage is always kept fixed by ensuring that the current through the diode-connected transistors always remains the same. This is accomplished by always turning on one of the 0bar to 4bar signals whenever the corresponding 0 to 4 signal is turned off, and vice-versa. In this way, the net PTAT voltage is changed because the drops across the individual resistor segments is changed, but the total PTAT current flowing into the diode-connected CTAT generator 3206 always remains the same.

Referring now to FIG. 33, the precision oscillator 236 disclosed herein additionally has the ability to perform real time on-the-fly frequency trim. This process is software controlled and allows frequency trimming on-the-fly responsive to control values within a table 3304 stored within the SRAM memory 3302 as shown in FIG. 33. The temperature sensor 552 periodically provides on-chip temperature measurements to the core processor 140 through the multiplexer 113 and the SAR ADC 110. The core processor 140 utilizes the provided temperature measurement to access a table 3304 within the RAM 3302 to determine if on-the-fly trimming of the oscillator frequency is necessary and finds the appropriate adjustment associated with the measured temperature.

This process is more fully illustrated in FIG. 34. A temperature reading is taken at step 3402 by the temperature sensor 552, and the processing core 140 determines at inquiry step 3404 whether the present temperature reading equals the previous temperature. If so, there is no need to change the frequency of the oscillator, and the process waits at step 3406 until a next temperature reading is taken according to some internal counter. If the temperature reading does not equal the previous temperature reading, the frequency associated with the new temperature is located within the table 3304 at step 3308. The new frequency associated with the new temperature is applied by the processing core at step 3410 which generates the necessary control signals to trim the oscillator to the new frequency. The new frequency is implemented in such a way that the adjustment of the frequency on-the-fly does not result in glitches within the clock signal from the oscillator. The fixed adjustment range in both the positive and negative directions is always available on-the-fly no matter how the part was initially trimmed at production. This is accomplished as shown in FIG. 35 by including a programmable thermometer-coded array 3520 of capacitors in parallel with the coarse-tune 3512 and fine-tune capacitor 3516 arrays in the design. At the nominal setting, this bank of capacitors is in the middle of its range. Therefore, no matter how the coarse-tune 3512 and fine-tune 3516 arrays are trimmed at production, there is always equal positive and negative range in the separate thermometer-coded temperature trim capacitor array. Since the coding in the temperature trim array is thermometer, each transition of the setting only results in a single capacitor being turned on or off, causing no clock glitches. If on the other hand, the temperature trim array were to have been implemented with binary-coding, then a worst-case DNL-error step, e.g. 0111 to 1000 would result in 3 binary-weighted capacitors being turned off and 1 binary-weighted capacitor being turned on all at the same time, causing a serious glitch in oscillator frequency.

Referring now to FIG. 35, there is illustrated how the coarse and fine tune frequency trimming of the capacitors of the RC circuit 410 are broken apart such that the coarse and fine tuning are performed separately at production. The RC circuit 410 illustrated in FIG. 35 includes a transistor 3502 having its source/drain path connected between VDD and node 3504. Resistor 3506 is connected between node 3504 and 3508. Transistor 3510 has its drain/source path connected between node 3508 and ground. The variable coarse capacitor array 3512 is connected between node 3508 and ground. The variable coarse capacitor array 3512 comprises a binary coded capacitor array. The fine capacitor array 3516 is connected between node 3508 and ground. The fine capacitor array 3516 includes binary coded capacitors for the lower significant bits and thermometer coded capacitors for the more significant bits. The temperature capacitor array 3520 is connected between node 3508 and ground. The temperature capacitor array 3520 includes only thermometer coded capacitors.

The binary coded capacitor array associated with the coarse capacitor 3512 is illustrated in FIG. 36. The binary coded capacitor array consists of a plurality of capacitors 3602 connected in parallel. A transistor 3604 is connected in series with each capacitor 3602. The transistor 3604 has its drain/source path connected between the associated capacitor 3602 and ground. The capacitive values of the capacitors 3602 double with each capacitor such that the first capacitor has a value of 1×, the second capacitor has a value of 2×, the third capacitor has a value of 4×, the fourth capacitor has a value of 8×, the fifth capacitor has a value of 16×, the sixth capacitor has a value of 32× and the seventh capacitor has a value of 64×. Likewise, the size of the transistors 3604 associated with each of the capacitors increase in range from 1× for the transistors associated with the 1× and 2× capacitors up to 2× through 32× for the transistors associated with the 4× through 64× capacitors. The coarse tune capacitor array 3512 contributes the majority of the total timing capacitance for the oscillator. Note that we have specifically chosen to place the switching transistors beneath their respective capacitors, instead of on top of them, for the following reasons: (1) Considerably less parasitic junction capacitance (which has a very high and nonlinear tempco) is added to the capacitor array from the switch, (2) The step size between each capacitance setting is smaller which leads to higher resolution, (3) Process variations in the switches will never cause the step size to go above a certain mathematically bounded value, and therefore also places a mathematical bound on the worst-case trim resolution, (4) The resistance of the switch is fixed and does not vary with Vgs or Vsb and thus the temperature variation of the switches has a more linear tempco and less variation with supply voltage.

The binary coded and thermometer coded capacitor array comprising the fine capacitor array 3516 is illustrated in FIG. 37. The binary coded portion of the array consists of a parallel combination of capacitors 3702. Each of the capacitors 3702 are in series with a capacitor 3704. In series with each capacitor 3702 and in parallel with each capacitor 3704 is transistor switch 3706. The transistor 3706 has its drain connected to capacitor 3702, its source connected to output node 3710 and its gates to signals Cal(0) and Cal(1). The thermometer coded portion 3716 of the fine capacitor array 3516 consists of a parallel combination of the following repeating circuit connected between top node 3708 and bottom node 3710. The repeating circuit includes a capacitor 3720 connected between the top node 3708 and node 3722. A second capacitor 3724 is connected between node 3722 and the bottom node 3710 in series with capacitor 3720. A switching transistor 3726 has its drain/source path connected between node 3722 and bottom node 3710. The gate of the transistor 3726 is connected to receive a trim control signal Cal(X) at its input gate. The desired capacitance is achieved by connecting/disconnecting capacitors into/from the capacitor array by applying a trim control signal to the gate of transistor 3726. Note that we have specifically chosen to place the switches beneath capacitors 3702 and 3720 for the same four reasons as previously explained with regards to the coarse array.

The temperature capacitor array 3720 consists of a thermometer coded capacitor array as illustrated in FIG. 38. The thermometer coded capacitor array consists of the following circuit repeated multiple times in parallel between a top node 3802 and a bottom node 3804. The repeating circuit includes a capacitor 3806 connected between node 3802 and node 3808. A second capacitor 3810 is in series with capacitor 3806 between node 3808 and node 3804. A switching transistor 3812 has its drain/source path connected between node 3808 and node 3804. The gate of transistor 3812 is connected to receive a trim control signal. The desired capacitance is achieved by connecting capacitors into the capacitor array by applying a trim control signal to the gate of transistor 3812. Note that we have specifically chosen to place the switches beneath capacitors 3806 for the same four reasons as previously explained with regards to the coarse array.

Coarse trimming of oscillator frequency using the coarse array and fine trimming of frequency using the fine array are performed separately during production trimming. Separation of the coarse and fine frequency trims, like this, significantly reduces the worst-case DNL error in the oscillator trimming, and therefore significantly improves the achievable frequency trimming resolution.

The LIN (Local Interconnect Network) interface 135 is an asynchronous, serial communications interface used primarily in automotive networks. LIN compatible devices implement a complete LIN interface 135 having a number of features. These features include a selectable master and slave modes, unique self-synchronization without a quartz crystal or a ceramic resonator in both the master and slave modes. The LIN interface includes fully configurable transmission/reception characteristics via special function registers (SFRs). The minimum system clock used with LIN peripherals is 8 MHz.

The LINBUS is a small, slow network system as illustrated in FIG. 39 that may be used as a cheap sub-network of a CAN (controller area network) BUS to integrate intelligent sensor devices or actuators in, for example, automobiles. LIN is a broadcast serial network comprising one master 3902 and up to 16 slaves 3904. No collision detection exists, thus all messages are initiated by the master with at most one slave replying for a given message identifier. In the present embodiment, the described circuitry would comprise the master 3902. However, in some embodiments the described circuitry could also be utilized as slaves 3904. The slaves 3904 may comprise smart sensors and actuators for obtaining data that is transmitted back to the processing core through the master 3902.

Referring now to FIG. 40, there is illustrated a block diagram of the main blocks of the LIN interface 135 enabling communications over a LINBUS. The LIN interface 135 includes register blocks 4002, LIN interface registers 4004 and various data buffers 4006. These are each in communication with the control free state machine and bit streaming logic 4008. The register blocks 4002 contain all registers used to control the functionalities of the LIN interface 135. The register blocks 4002 include LINCTRL; LINST; LINERR; LINSIZE; LINDIB; LINMUL and LINID. The LIN interface register 4004 provide the interface between the microcontroller core and a peripheral LIN device which is communicating with the core. The LIN interface registers 4004 include the LINCF; LINDAT; and LINADDR. The data buffer 4006 contain the registers where transmitted and received message data bytes are placed from transmissions between the microcontroller core and the peripheral LIN devices. The data buffer registers include LINDT1 through LINDT8. The control free state machine and bit streaming logic 4008 contain the hardware necessary for serializing messages, and the circuitry for providing timing control to the peripheral LIN devices.

Communications with the LIN interface 135 are done indirectly through a pair of LIN interface registers 4004 called LINADDR 4010 and LINDATA 4012. The selection of the master or slave mode and the automatic baud rate feature are accomplished through the LINCF register 4014. In order to write to a specific register block 4002 other than the three LIN interface registers 4004 requires the system to first load the LINADDR register 4010 with the address of the required LIN register 4002 and then to load the data to be transferred to the register block 4002 using the LINDATA register 4012. This process is more fully illustrated in FIG. 41. An instruction to write to one of the register blocks 4002 is received at step 4102. An address of the register block to which the data is to be written is loaded at step 4104 into the LINADDR register 4010 of the LIN interface registers 4004. Next, at step 4106, the data to be loaded into the register block 4002 is loaded into the LINDATA register 4012 of the LIN interface registers 4004. Finally, the data from the LIN data register 4012 is written to the register block 4002 indicated by the LINADDR register 4010.

Referring now to FIGS. 42 through 44, there are illustrated the control register tables for the LINADDR register 4010, the LINDATA register 4004 and the LINCF register 4014. FIG. 42 illustrates the control bits for the LINADDR register 4010. The register contains eight bits for storing addresses to which the LIN peripheral devices may write. FIG. 43 illustrates the control bits for the LINDATA register 4012. This register contains eight bits for writing data to and from the register blocks 4002 and data buffers 4006. Finally, FIG. 44 illustrates the LINCF register 4014 bits. Bits 0-5 are used for data and bit 6 is used to illustrate whether an automatic bit rate selection or manual bit rate selection system is to be used. This bit is only utilized within the slave mode of operation for the LIN devices. Bit 7 is used to indicate the LIN operation mode selection. A “1” is used to indicate the master mode of operation and a “0” is used to indicate the slave mode of operation.

Referring now to FIG. 45, there is illustrated the configuration of the remaining LIN data control registers including the register blocks 4002 and the data registers 4006. Each of the register block registers 4002 and data block registers 4006 are used in each of the master and slave modes. Register bits that are marked with (m) are accessible only in the master mode of operation where the register bits marked with the (s) are accessible only in the slave mode of operation. All remaining register bits are accessible in both modes of operation.

The data buffer registers consist of the registers LINDT1 through LINDT8. These registers each include eight bits for storing a single serial data byte that is to be received by or transmitted by the LIN interface registers 4004.

The LIN control register (LINCTRL) is a register block 4002. Bit 7 of the LIN control register comprises the stop bit (STOP). This bit is to be set by an application to block the processing of the LIN communications until a next SYNC BREAK signal. The stop bit is used when the application is handling a data request interrupt and cannot use the frame's content with the received identifier. Bit 6 comprises the sleep mode warning bit (SLEEP). This bit is set by an application to warn the LIN peripheral that a sleep mode frame has been received and that the LINBUS is in the sleep mode. Alternatively, it notifies the peripheral if a bus idle time out interrupt has been requested. The application resets the sleep mode warning bit when a wake up interrupt is requested. Bit 5 of the LIN control register comprises the transmit/receive selection bit (TXRX). This bit is set by an application to select if the current frame is a transmit frame or a receive frame. Bit 4 of the LIN control register comprises the data acknowledge bit (DTACK). This bit is only utilized in the slave mode of operation. This bit is set by the application after handling a data request interrupt and is reset by a LIN peripheral. Bit 3 comprises the interrupt reset bit (RSTINT) of the LINCTRL register. This bit is set by an application to reset the interrupt bit in the LIN status register (LINST). Bit 2 comprises the error reset bit (RSTERR) of the LIN control register. The application must set the RSTERR bit in order to reset the error bits in the LIN status register (LINST) and the LIN error register (LINERR) bits. Bit 1 comprises the wake up request bit (WUPREQ). This bit is set by an application to end the sleep mode of the LIN bus by sending a wake up signal. The bit 0 bit comprises the start request bit (STREQ) of the LINCTRL register. This bit is only utilized in the master mode of operation. This bit is set by an application to start a LIN transmission. It may be set only after loading the identifier, data link and data buffer. The bit is reset by a peripheral LIN device upon completion of the transmission or error protection.

The LIN status register (LINST) includes eight different control bits. Bit 7 comprises the LINBUS activity bus bit (ACTIVE). This bit shows when transmission activity on the LINBUS is detected by a peripheral device. Bit 6 comprises the bus idle timeout (IDLTOUT) of the LIN status register. This bit is set by the peripheral device if no bus activity is detected over a period of 4 seconds and the sleep bit in the LIN control register (LINCTRL) is not set by the application. Upon settling this bit, the peripheral also sets the interrupt request bit (LININT) and the applications can then assume that the LINBUS is in sleep mode and set the sleep bit. Bit 5 comprises the aborted transmission signal bit (ABORT). This bit is only used in the slave mode of operation. The aborted transmission signal bit is set by a peripheral device when a new SYNC BREAK signal is detected before the end of end of the last transmission. The transmission is aborted and the new frame is processed. The aborted transmission signal bit is also set when the application sets the stop bit of the LINCTRL register. Once a SYNC BREAK signal is received this signal is reset. Bit 4 comprises the data request bit (DTREQ). This bit is only used in the slave mode of operation. A peripheral device sets this bit after receiving the identifier and requests an interrupt. Bit 3 comprises the interrupt request bit (LININT). This bit is set when an interrupt is issued and has to be reset by the application by setting the RSTINT bit within the LINCTRL register. Bit 2 comprises the communications error bit (ERROR). A peripheral device sets this bit if an error has been detected. The bit must be reset by the application by setting the RSTERR bit of the LINCTRL register. Bit 1 comprises the wake up request bit (WAKEUP). This bit is set when a peripheral is transmitting a wake up signal or has received a wake up signal. Finally, Bit 0 comprises the transmission complete bit (DONE). A peripheral device sets this bit at the end of a successful transmission and resets the bit at the start of another transmission.

The LIN error register (LINERR) also includes 8 bits. Bits 7 through 5 are unused in the LIN error register. Bit 4 is the synchronization error bit (SYNCH) and is only used in the slave mode of operation. A peripheral device detects edges of a SYNC FIELD outside the maximum tolerance and sets this bit in response thereto. Bit 3 comprises the parity error bit (PRTY). This bit is only used in the slave mode of operation and is set when a parity error is detected. Bit 2 comprises the time out error bit (TOUT). This bit is set whenever one of a number of time out error conditions are met. Bit 1 comprises the checksum error bit (CHK). This bit is set when the peripheral device detects a checksum error. The bit 0 bit comprises the bit error bit (BITERR). The error bit is set when the bit value monitored by the peripheral is different from the ones transmitted.

The LIN message size register (LINSIZE) comprises an eight bit register. Bit 7 comprises the checksum version selection bit (ENHCHK). This provides an indication of the checksum version used by the peripheral. Bits 6 through 4 are unused in the LIN message size register (LINSIZE). Bits 3 through 0 indicate the size of the LIN data field. The data field may comprise 2, 4 or 8 bytes.

The LIN divider register (LINDIV) comprises an eight bit register using bits 7 through 0 for containing the eight least significant bits of the divider used to generate the baud rate of the LINBUS. The LIN multiplier register (LINMUL) is an eight bit register wherein bits 7 and 6 comprise a prescaler used to create the baud rate. Bits 5 through 1 comprise a multiplier used to create the baud rate and bit 0 comprises the most significant bit of the divider used to create the baud rate. The LIN ID register (LINID) is an eight bit register wherein bits 7 and 6 are unused. Bits 5 through 0 are used for the identifier.

Using the LIN interface enables the device to operate within a LIN network as a master node or slave nodes. All nodes would include a slave communication task that is split into a transmit and a receive task while the master node further includes an additional master transmit task. In most applications, the described device will operate as the master node within a LIN network. It may communicate with a number of different LIN peripheral devices acting as slaves. In one example, the slave nodes may comprise various sensors within an automobile associated with major systems of the car such as the transmission, tires, oil sensor, temperature sensor, etc. Automotive applications include body control, driver information, multimedia, climate control, safety equipment, cockpit electronics and human/machine interface.

It will be appreciated by those skilled in the art having the benefit of this disclosure that this invention provides a LINBUS interface within a processing device. It should be understood that the drawings and detailed description herein are to be regarded in an illustrative rather than a restrictive manner, and are not intended to limit the invention to the particular forms and examples disclosed. On the contrary, the invention includes any further modifications, changes, rearrangements, substitutions, alternatives, design choices, and embodiments apparent to those of ordinary skill in the art, without departing from the spirit and scope of this invention, as defined by the following claims. Thus, it is intended that the following claims be interpreted to embrace all such further modifications, changes, rearrangements, substitutions, alternatives, design choices, and embodiments. 

1. An integrated system on a chip with LINBUS network communication capabilities, comprising: processing circuitry for performing predefined digital processing functions on the chip; an on-chip free running clock circuit for generating a temperature compensated clock, which said on-chip free running clock circuit does not require a synch signal from external to the chip; a first network communications interface for providing serial communication with an off-chip communications device; a LINBUS network communication interface for digitally communicating with an off-chip LINBUS device for transmitting data thereto and receiving data therefrom, which off-chip LINBUS device has an independent time reference, which communication between said on-chip LINBUS network communication interface and said off-chip LINBUS device is effected without clock recovery, said LINBUS network communication interface having a time-base derived from said temperature compensated clock, which time-base is independent of any timing information in the input data received during a receive operation; and wherein said temperature compensated clock provides an on-chip time reference for both said processing circuitry and said LINBUS network communication interface.
 2. The integrated system on the chip of claim 1, wherein said free running clock circuit comprises: a switching circuit for switching between first and second logic states at a predetermined frequency, said switching circuitry changing between said first and second logic states based upon a trip voltage, said switching circuitry having an inherent temperature profile associated therewith; and a temperature compensated trip voltage generator for outputting a defined trip voltage that is compensated over temperature to offset the temperature profile of said switching circuit to provide an overall temperature compensated operation for said free running clock circuit.
 3. The integrated system on a chip of claim 2, wherein said temperature compensated trip voltage generator includes at least two resistive devices of different materials and having different temperature coefficients.
 4. The integrated system on a chip of claim 3, wherein said at least two resistive devices have positive temperature coefficients.
 5. The integrated system on a chip of claim 3, wherein said temperature compensated trip voltage generator comprises a divider circuit with a top resistor connected in series with a bottom resistor between two supply terminals of differing voltages, said at least two resistive devices connected in parallel and comprise at least a portion of said bottom resistor.
 6. The integrated system on a chip of claim 5, wherein said top resistor sets the value of said trip voltage.
 7. The integrated system on a chip of claim 6, wherein said at least two resistive devices have the values varied to set the temperature coefficient of said trip voltage.
 8. The integrated system on a chip of claim 3, wherein one of said at least two resistive devices comprises an n-diffusion resistor and the other thereof comprises a polycrystalline silicon resistor.
 9. The integrated system on a chip of claim 2, wherein said switching circuit comprises: a comparator circuit that is comprised of first and second comparators, each of said first and second comparators having a reference input connected to receive said temperature compensated trip voltage output by said temperature compensated trip voltage generator with the output of each of said two comparators changing logic states between a first logic state and a second logic state when the other input thereof passes said trip voltage; and an RC timing circuit for defining when each of said two comparators switches the outputs thereof by providing a feedback that is input to the other input of each of the two comparators.
 10. The integrated system on a chip of claim 9, wherein said RC timing circuit sets the frequency of said free running clock circuit and said RC timing circuit is variable.
 11. The integrated system on a chip of claim 10, wherein said RC timing circuit comprises: a first RC circuit and a second RC circuit; said first RC circuit and said second RC circuit each comprising a resistor connected through a switching device having an associated switch input between a first supply terminal and one side of a first capacitor, the other side of said first capacitor connected to another different supply terminal wherein current is switchable through said resistor to charge said capacitor; said first and second RC circuits having said associated switch input connected to an associated one of said two comparator outputs such that charging up of the associated one of said first capacitors will cause the voltage at the one plate thereof to be fed back to the other input of the other of said two comparators wherein the other of said two comparators will switch when the voltage on the one plate of said associated first capacitor exceeds the trip voltage.
 12. The integrated system on a chip of claim 9, wherein each of said comparators includes a differential input pair of MOS transistors for providing the two inputs thereto, and further comprising an offset circuit for offsetting the voltage between the differential input pair of MOS transistors.
 13. The integrated system on a chip of claim 12, wherein said offset circuit comprises a parallel offset transistor disposed in parallel with one of the differential input pair of MOS transistors. 